Samsung claims to have developed a new kind of bonding technology to stack chips with connectivity through the silicon.

This sort of technology potentially has a significant impact on mobile devices…… reduced use of copper connections should mean lower drain on power and increase speed. If you can do this one can only imagine the product differentiation that ensues. Mobile devices that have vastly increased capabilities with seemingly limitless power supply on the go….

This entry was posted on April 14, 2006 at 11:39 pm. You can follow any responses to this entry through the RSS 2.0 feed. You can leave a response, or trackback from your own site.

Posted in Main Page by Chris Gilbey No Comments Yet